Produkty dla pakiety wilgoci (1)

Certain plastic encapsulated surface mount devices (SMDs), if not handled properly, can incur damage during the solder reflow attachment process to printed circuit boards (PCBs). In order to prevent damages, the moisture sensitive product is typically baked before packing. After baking, the product is placed inside a DryPack bag along with predetermined amount of desiccant and a humidity sensitive indicator card (refer to JEDEC JSTD033C). The vacuum sealed bag is labeled and placed in a pizza box carton.